微电子封装外壳电镀前处理述评 关键词：微电子封装外壳；镀前处理；非常规处理；镀层质量 [gap=682]Keywords：microelectronics package；pretreatment；unconventional treatment method；coating quality
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研究了钨表面镀前处理及预镀铬、镍，然后镀金的工艺条件；
The paper studied the pre treatment for electroplating the surface of tungsten and technical conditions for chromate treatment, nickel and gold plating, determined the functions of cladding material.
结果表明，镁合金基体的镀前处理对镀层的结合强度至关重要。
Results show the pretreatment of basal body of magnesium alloy is important to the bond strength.
针对PP化学稳定性好、憎水性强的特点，采用了特殊的镀前处理方法。
By using special pretreating method before plating aiming at the characteristics of good chemical stability and hydrophobic behavior of PP.
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