机床。带4个键的花键轴和花键孔的剖面。内定心。尺寸。
Machine Tools; Spline Shafts and Spline Bore Profiles with 4 Splines, Internal Centering, Dimensions.
将实现3d互连的方法分为引线键合、倒装芯片、硅通孔、薄膜导线等，并对它们的优缺点进行了分析。
The methods of 3d interconnection can be classified into the wire bonding, flip chip, through silicon via (TSV) and film wire technology, whose advantages and disadvantages are analyzed.
分析了变容二极管的等效电路模型，考虑了微带的不连续性、键合引线、通道孔对电路的影响。
The bond wire, the via hole and the uncontinuity of the microstrip's effect have been taken into account .
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