采用多普勒激光振动测量系统，获得了热超声倒装键合过程中工具末端及芯片的振动速度曲线。
With the Doppler laser vibration measurement system, the vibration velocity curves of the flip chip and tool tip were obtained during thermo-sonic flip chip bonding.
本文采用热反应键合法，将PEG - 20 M与405白色硅藻土载体进行热键合制备气相色谱键合固定相。
A bonded stationary phase for gas chromatography has been prepared by the thermal reaction between 405 white support and PEG 20m.
基于解析模型的方法，研究了超声波在热超声金丝球引线键合机变幅杆中的传递规律。
Based on the analysis model, the ultrasonic transfer on the horn of wire bonder was studied.
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