两步走的策略被采用：第一步，建立键合力控制系统的闭环模型；
The first step is to model the close loop control system of wire bonding force.
在超声引线键合过程中，键合力是影响键合强度的重要因素之一。
In ultrasonic wire bonding process, the bonding pressure is one of the most important factors to the bonding strength.
结果表明：氢的存在使断裂激活能约降低74%。这说明其减弱了原子间键合力。
The results show that hydrogen reduces the fracture activation energy by 74%, that is, atomic binding force decreases.
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