焊接时产生的锡珠少，减少短路现象的发生。
Very few Soldering Balls occur and cut down the short circuit.
锡焊料从抵抗防止导体间，从而营造桥短路。
The solder resist prevents solder from bridging between conductors and thereby creating short circuits.
锡须，一种自发从锡和锡合金层生长出来的现象，它会导致 电路短路，影响电子产品长期的 可靠性。
Tin whiskers, growing spontaneously from Sn and Sn alloy coatings, can cause electrical shorts in the circuit and present a long-term reliability problem to the electronic industry.
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