数量众多的直径约为几微米的铁粒子和铜基体组成了冷却表面的微观组织。
The microstructure of cooling surface was made up of large numbers of iron particles with several micron diameter and copper base.
采用电位阶跃法研究了铜基体上柠檬酸及其钾盐的缓冲溶液中锑的电结晶过程。
The single potential method was adopted to study the electrocrystallization of Sb on the copper cathode from aqueous citric acid and potassium citrate bath.
当其它条件都相同时,在铜基体上获得钨镀层比钼基体上所需的温度略高一些;
The temperature for tungsten coating on copper substrate is higher than that on molybdenum.
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