对预热温度、焊料槽温度和焊剂体积进行优化后，还可将传送带速度降低，以适应使用无铅焊料时的熔湿速度。
Having optimized preheat temperatures, solder pot temperatures, and flux volume, the conveyor speed may have to be reduced to accommodate the solder wetting when using lead-free solder.
并对炼铜、炼镍、炼铅炉关键部位所用镁铬材料，炼料、铝电解槽各部位所用材料进行了阐述与介绍。
The magnesite-chrome refractories used in the critical parts of copper, nickel and lead making furnaces, and refractories used in various parts of aluminium reduction cell are described as well.
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