它可由高速运动的电子群（束）突然受阻，电子束撞击钨靶（tungsten target）或钼（铑）靶（molybdenum target），发生能量转换而产生。
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采用SEM、EDS和化学成分测试等方法，对两种钨靶进行了研究和比较。
In this paper, two kinds of pure tungsten target are studied and compared by using SEM, EDS and chemical elements tests.
结果显示，杂质元素的含量偏高和沿晶界的偏析以及不均匀的钨晶粒是造成国产钨靶表面损伤的主要原因。
The results show that high content of impurity elements, segregation along grain boundaries and uneven grain size are main reasons for the surface damage of domestic tungsten targets.
结果显示，杂质元素的含量偏高和沿晶界的偏析以及不均匀的钨晶粒是造成国产钨靶表面损伤的主要原因。
The results show that high content of impurity elements, segregation along grain boundaries and uneven grain size are main reasons for the surface damage of domestic tung...
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