对如何通过研究铝的点蚀扩展动力学来预测点蚀扩展行为，同时对钝化膜的半导体性能、电子性能进行了概述。
How to predict the pit growth behavior by introducing pit growth kinetics is summarized, and some properties of passive film, such as semi conductive and electronic properties, are also discussed.
实验证实碳点存在一定的毒性，并且PEG钝化后碳点毒性降低。
Our results demonstrated that the C-Dots were toxic and the surface passivation with PEG reduced the toxicity effectively.
在初始阶段，形成的点蚀芯连续被修复的钝化膜，这会导致在电感元件中的电化学阻抗谱。
At the initial stage, the pitting cores are formed and the passive film is repaired continuously, which results in the inductive component in the electrochemical impendence spectrum.
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