分析了金丝与金导体键合的可靠性问题，总结了金丝键合失效的原因，并提出了改进的措施。
Then it analyzes the reliability problems of the bonding between spun gold and gold conductor, and proposes an improved measure after summarizing the causation of spun gold bonding fault.
最后，进行了阳极键合、金-硅键合试验，研究了试验中影响键合强度的关键因素，提出了较为可行的键合工艺。
Finally experiments of anodic bonding and Au-Si bonding have been carried out to find out the key factors related to the bonding strength, and the most feasible bonding manners are put forward.
本文以在建中的金塘大桥的索塔锚固区剪力键选型试验和节段足尺模型试验为项目背景。
The type of shear connectors selection test and full-scale model test for the anchorage zone segment of Jintang Bridge, which is under-construction, were the project background.
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