分析了金丝与金导体键合的可靠性问题，总结了金丝键合失效的原因，并提出了改进的措施。
Then it analyzes the reliability problems of the bonding between spun gold and gold conductor, and proposes an improved measure after summarizing the causation of spun gold bonding fault.
胞嘧啶的环呼吸振动频率随着电位负移而红移，这意味着它与金电极的成键作用减弱。
The binding interaction between cytosine and the gold electrode was weakened when the potential was negatively moved.
最后，进行了阳极键合、金-硅键合试验，研究了试验中影响键合强度的关键因素，提出了较为可行的键合工艺。
Finally experiments of anodic bonding and Au-Si bonding have been carried out to find out the key factors related to the bonding strength, and the most feasible bonding manners are put forward.
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