试验结果表明，用受控电子束熔炼粉末金属可以获得满意的中间层材料。
The experimental results indicate that the powder fusion metallurgy with the controlled EB can achieve the approved interlayer.
以镍、钴、钯镀层作为铜基体镀金的防渗铜中间层可以有效地防止铜原子扩散到金属表面。
Nickel, cobalt and palladium electrodeposits used as barrier layer between copper basis and gold deposit can effectively reduce migration of copper atom to gold upper deposit.
还公开了在不需要金属中间层的情况下，直接在硅表面上自催化镀覆银金属的方法。
A method for autocatalytic plating of silver metal directly onto a silicon surface without the need for an intervening layer of metal is also disclosed.
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