一种改善变形的半导体封装基板，主要包括一可挠性介电层、多数个引脚、至少一补强金属图案以及一防焊层。
A semiconductor package substrate for preventing deformation mainly comprises a flexible dielectric layer, a plurality of pins, at least one reinforced metal pattern and a solder mask layer.
如此，藉由覆层补强金属的增设，可有 效增加结构强度，对抗外部应力防止断裂。
Therefore, by means of the additional arrangement of the coated reinforced metal, the strength of the structure can be effectively improved to resist external stress and prevent cracking.
蒸气制冷剂产生减缓膨胀气体的膨胀速率的补强蒸气，从而将膨胀气体留存在金属表面上。
The vaporous cryogen creates a reinforcing vapor that slows the expansion rate of the expanding gas, localizing the expanding gas over the metal surface.
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