本发明公开了耐热性和粘合性优异的可以形成微细布线的适于挠性印制线路板的金属复合膜及其制造方法。
A metal composite film that excels in heat resistance and adhesion, being suitable for use in a flexible printed wiring board capable of minute wiring formation; and a process for producing the same.
镀层延展性好，平整、外观良好，可用于印制线路板的孔金属化及其它塑料电镀。
It can be used to metalize holes of PCB and plate on plastics.
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