介绍了一种全新的体硅微机械工艺，可以取代SOI硅片而直接在普通硅片上对不同的侧壁电学导通部分进行绝缘。

Introduced a new bulk silicon micromaching technology to replace SOI wafer with normal silicon wafer in the application of sidewall electrical connection.

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预计未来五年将筹集4.1亿美元，其中大部分将用于该市的一通用学前教育项目。

It's expected to raise $410 million over the next five years, most of which will go toward funding a universal pre-kindergarten program for the city.

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第4部分：钻通(Drill - through)和其他高级主题。

Part 4: Drill-through and other advanced topics.

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