对通用级聚苯乙烯进行改性，并以改件后聚苯乙烯为基料制备防腐蚀涂料。

A polystyrene corrosion protective coating has been developed based on a modified polystyrene polymer as binder.

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印制电路用基材。第2部分：规范。第13号规范：通用级软覆铜聚酰亚胺薄膜，通用级。

Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade.

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将少量相对高分子量的高密度聚乙烯(HDPE)加入到相对低分子量的通用级HDPE中，在复合应力场作用下挤出制成管材。

A small amount of high molecular weight HDPE was added into relative low molecular weight HDPE under compound stress field to extrude pipe.

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