博通和高通两家移动元件制造商针对无线技术已相互发起诉讼达数年之久,直到去年才解决。
Broadcom and Qualcomm, two mobile component makers, sued each other for years over rights to wireless technology before settling last year.
将电路板放置在焊台上,针对需要焊接的通孔元件管腿,选择合适的喷锡口,启动波峰焊接。
The circuit board is placed in the welding stage, the pins through hole components welding, choose appropriate spray tin, soldering start.
采用喷流焊的方法拆除这些通孔元件可以避免这些问题。
Using the method of jet welding dismantling these through-hole components to avoid these problems.
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