在1773 ~ 1973 K温度范围内，满足溅渣护炉的炉渣条件下，在真空碳管电阻炉中对转炉渣进行了硅热还原实验研究。
From 1773 K to 1973 K, the reduction experiments of converter slag simulated for slag splashing by silicon were carried out in a vacuum graphite tube resistance furnace.
这是一个复杂的过程，在充满微粒子的真空环境下对产品进行离子溅镀，以在产品表面形成保护层。
It is a sophisticated process, performed under vacuum which deposits microscopic particles on the products by ion bombing or sputtering, to form a protecting coating on their surface.
对电真空钎料溅散性的各种影响因素进行分析对比。
Different influence factors on the spatter property of the electronics vacuum filler metals have been analysed and contrasted.
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