统计分析了焊接缺陷主要是表现为锡球断路、焊锡过流、锡球分布不对称以及烧焦和锡溅，主要受锡球大小、焊盘相对位置以及有关加工参数的影响。
By statistical analysis, the defects are tin-ball short, overflowing, dissymmetry, splash and scorch, which are mainly affected by the tin-ball size, pad positions, and process parameters .
根据本发明，不含树脂的焊膏由一种金属粉末，特别是软焊料 和一种凝胶体制成，其中，根据本发明的凝胶体在重熔金属粉末的过 程中，不在金属表面上留下残留物。
The invention relates to a nonresinous solder paste made of a metal powder, especially soft solder, and a gel which leaves no residues on the metal surface when the metal powder is melted down.
适用于回流焊时对金手指的保护，电子线路板过锡炉和波峰焊锡遮蔽。
Suitable for reflow when cheat protection, electronic circuit boards wave soldering tin stove and shelter.
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