软质类植物磨料，具有良好的耐用性和柔软性，并能和其他抛光材料混合使用。
Soft kind of botanic abrasives, with good durable and pliable properties, can be used mixed with other polishing abrasives.
软质层的存在一方面增大单个磨料所去除材料的体积，增加材料去除速率；
The existence of the soft layer could increase the material volume removed by one particle and increase the material removal rate during CMP.
提出当磨料嵌入晶片表面的最大深度等于或接近于软质层厚度时，在理论上应具有最佳的抛光效果。
The best polishing can be obtained while the depth of particles indented into wafer surface was equal to or near to the thickness of soft layer.
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