根据本发明，不含树脂的焊膏由一种金属粉末，特别是软焊料 和一种凝胶体制成，其中，根据本发明的凝胶体在重熔金属粉末的过 程中，不在金属表面上留下残留物。
The invention relates to a nonresinous solder paste made of a metal powder, especially soft solder, and a gel which leaves no residues on the metal surface when the metal powder is melted down.
焊接端口阀门适用于不需要拆卸的软焊接管线，采用低温焊料(204oc)。
Solder end valves are designed to be soft soldered into lines without disassembly, using a low temperature solder (400of) (204oc).
对多种锡铅焊料进行一系列不同条件下的漫流性试验 ，分析它们在铜表面上的铺展状况 ，最后归纳出焊料成分、钎焊温度、助焊剂对软钎焊料漫流性影响的规律。
The results show that the melting properties of the solder alloy are satisfactory, and the soldering temperature and time have much effect on the shearing-strength of the joints.
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