大部分是在巨大的，超净的工厂中采用类似于生产硅片的工艺来分批制成的。
Most are produced in huge, ultra-clean factories using batch processes similar to those for making silicon chips.
为了简化运输和尽可能降低被污染的风险，芯片制造商利用“前开式标准晶圆盒”即所谓的FOUP来搬运晶圆。每个无尘超净的晶圆盒中可放置25块硅晶圆。
To simplify transportation and minimize the risk of contamination, fabs make use of "front-opening unified pods, " or FOUPs. Each one holds 25 wafers in a sterile, clean environment.
超净台使用寿命的长短与空气的洁净程度有关。
Clean Bench length of life related to the degree of air cleanliness.
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