通过赫尔槽试验优选出最佳镀液配方和工艺条件。
The optimum bath formula and process conditions were obtained by Hull Cell test.
本文主要阐述赫尔槽基本原理及其在印制电路板电镀过程中的应用。
In this article, the basic theory of Hull Cell Testing and its application in electroplating process for printing circuit board is explained.
通过赫尔槽试验研究了镀液中各成分含量、操作条件及电源对镀层外观的影响。
Effects of each component content in solution, process conditions, power source on appearance of Sn deposit were studied by Hull Cell test.
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