在印制电路板的生产过程中，表面贴装是极为重要的一环，其速度直接影响着生产效率的高低。
In the process of print circuit board (PCB) production, the surface mount is an extremely important step, its speed directly affects the production efficiency.
一种方法是使用表面贴装3轴加速度计是已经存在于许多智能手机，如飞思卡尔半导体MMA8653，以确定该终端的方向。
One approach is to use a surface-mount 3-axis accelerometer that is already present in many smartphones, such as the Freescale Semiconductor MMA8653, to determine the orientation of the terminal.
整个SIPLACE D 系列平台都配备了SIPLACE数字成像系统，此系统可进行数字化分析和处理，提高了元件识别的速度和可靠性，具有更高的贴装安全度。
The digital SIPLACE vision system for the entire SIPLACE D-Series platform allows for digital data analysis and processing for faster and reliable component recognition and higher placement security.
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