由于转换时的停机时间是整体操作成本的重要因素，所以电路板传输系统对降低每个贴装单位成本起着一定的作用。
Since downtime for changeovers is an important factor in overall operating costs, the board transport system has a very substantial part to play in reducing cost per placement.
建构了电路板锡膏的三维测量系统，实现了印刷锡膏均匀性参数的获取，从而达到对表面贴装质量进行监控和评价的目的。
The uniformity parameters of solder paste can be extracted by this system, which is competent for the quality control of surface mount technology (SMT) product line.
它通过视觉识别系统对不同元件进行视觉识别，能高速高精度贴装微小片状元件、精细ic元件或异形元件。
It can identify different components through visual identifying system, and mount microminiaturize flat chip with high speed and high precision, and also including subtle IC and abnormity components.
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