工程师们不能利用最先进的制造制程，这种情况被称作设计鸿沟(design gap)，这种状况推动半导体产业寻求更新的设计方法，于是，将设计再使用作为一种提高设计生产能力的可行方法遂应运而生。
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设计、编码和测试三者之间的鸿沟将不再存在，这样可以促进你对整个环境更好地理解。
The long gaps between the design, coding, and testing phases are gone, thus making for a much better learning environment.
使用设计模型来连接在需求和代码之间的鸿沟是重要的；设计模型可以在开发和测试之前很久捕获错误和有问题的假设。
Bridging the gap between requirements and code with a design model is critical; it catches mistakes and faulty assumptions long before development and testing.
然而，通常基于UML的软件系统的四种模型中，从用例分析模型到其它设计模型之间存在一条很难逾越的鸿沟。
But there usually exists a gap which it is difficult to overstep from use case analysis model to other design models in four UML-based models of software system.
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