目前LED同硅晶片的制作设备类似，都是通过在蓝宝石衬底片上沉淀氮化镓层实现。
At present these LEDs are made in machines similar to those used to make silicon chips, by depositing layers of gallium nitride on sapphire-based wafers.
反应物在初始阶段因高速旋转盘的牵引力被竖直向下地泵入，然后偏斜形成一个与衬底片托盘平行的流动区域。
The reactants are initially pumped vertically downward by the viscose drag force of the high speed rotating disk, and then are deflected to form a flow region that is parallel to the wafer carrier.
通过对蓝宝石衬底片精密加工的设备、工具、辅料、清洗等方面的研究，优化了衬底片加工工艺，提高了衬底片加工质量，且降低了加工成本。
It can obviously improve the quality of substrate sapphire's appearance and reduce the production cost to ameliorate technological parameters of precision cutting process.
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