另外，在阻焊膜涂覆前，用等离子体对印制电路板面处理一下，还可获得一定的粗糙度和高活性的表面，从而提高阻焊膜层的附着力。

In addition, the solder mask coating on printed circuit board, with the plasma treatment, can also obtain certain roughness and high active surface, thus improving the solder coating adhesion.

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利用等离子弧对低碳钢表面预涂的铁基自熔性合金粉末进行了熔覆处理，并对熔覆层的组织结构和性能进行了分析研究。

The self molten Fe base alloy powder on low carbon steel precoated sheet was melted by thermal plasma arc. The microstructure and hardness of the clad coating were analyzed.

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