元件制程：蚀刻，表面钝化，介电材料薄膜。
Device Processing: Etching. Surface passivation; dielectric films.
薄膜先以微影及蚀刻制程制作出金属线路，线路之间则填入二氧化矽。
The lithographic and etching process for a membrane creates a mesh of metal wires with silicon dioxide filling the space between them.
一串制程因子的实验设计，以晶圆薄膜厚度近九点量测。
A fairly large fractional factorial experiment on epi growth was performed, with spatial measurements of thickness and resistivity.
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