... thin film circuit 薄膜电路 thin film chip 薄膜芯片 thickness/resistivity sorter 厚度 电阻率分选机 ...
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在 350 mA 的工作电流下效率可高达 119lm/W(70mA 时为 136lm/W),LED的这项新纪录源自最新一代红色1 mm2薄膜芯片(InGaAlP),该..
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... film-coefficient; heat transfer 热传膜层系数 film chip 薄膜芯片 film cooling 液膜冷却 ...
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而薄膜芯片技术 Thin film LED
薄膜芯片技术 Film technology
薄膜倒装芯片 TFFC ; Thin-film Flip-chip
薄膜倒装芯片技术 TFFC
其最新的薄膜倒装芯片 TFFC ; thin- film flip- chip
薄膜上接芯片 COF
淀积薄膜型多芯片组件 mcm-d
在制作上,根据性能和结构要求,采用了高密度布线、多芯片组装的薄膜工艺。
For fabrication, a thin film process of high density routing and multi-chip assembly is adopted to meet the performance and structure requirements.
芯片的结构很复杂,里面有薄膜、还有很细的导线。
The structure of microchips is very complicated, inside there are membranes, and also very fine wires.
将实现3d互连的方法分为引线键合、倒装芯片、硅通孔、薄膜导线等,并对它们的优缺点进行了分析。
The methods of 3d interconnection can be classified into the wire bonding, flip chip, through silicon via (TSV) and film wire technology, whose advantages and disadvantages are analyzed.
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