激基缔合物的形成从TMEP在薄膜状态下与溶液状态下的荧光光谱的比较中得到证实。
The difference between PL spectra of TMEP solution and PL spectra of TMEP solid film confirms the formation of excimer.
激基缔合物的形成从TMEP在薄膜状态下与溶液状态下的荧光光谱的比较中得到证实。
The difference between PL spectra of TMEP solution and PL spectra of TMEP solid film confirmed the formation of excimer.
电子显微镜观察与分析表明，晶界上的薄膜状硼化物是导致合金缺口敏感的主要原因。
Analysis and observation under electron microscope indicated that it seems to attribute the notch sensitivity of the alloy to the film-like boride along the grain boundaries substantially.
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