最大累积等效蠕变应变位于内层焊点，且在芯片边缘。
The maximum cumulative equivalent creep strain was located in inner solder ball and at the edge of silicon chip.
再看驱动器的角落和边缘。在这里你可以找到凹痕和芯片上，可以判断该驱动器跌落或撞击。
Look at the corners and edges of the drive. There you can find dents or chips on the paint that can point that the drive was dropped or hit.
例如某一层的CNN芯片能够辨认出物体的边缘，而另一层能辨别出色彩。
One layer, for example, would be able to pick out edges, while another picks out color.
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