芯片互连. Chip Interconnection
嵌入式多芯片互连桥接 EMIB
高密度多芯片互连 high-density multichip interconnect ; saling sambung multicip ketumpatan tinggi
芯片级互连引线键合 wire bonding ; WB
手机互连芯片商莱迪思 Lattice Semiconductor
芯片内互连线 on-chip interconnects
面阵列芯片封装互连 Planar array chip packaging interconnecting
当今信息具有存储量大、传输速度快、可靠性高等现实需求，芯片互连技术在其中发挥着重要作用。
Today's information have the performance of high capacity, fast transmission and high reliability, chip interconnection plays a critical role in it.
介绍了MCM-C的CAD设计方法，以及MCM-C基板的制作与金属化、芯片的测试和老化、芯片互连等工艺。
This paper describes the CAD method for MCM-C, the fabrication and metallization processes of MCM-C substrates, and the technologies for die test, burn-in and interconnection.
在一个集成电路中，多个芯片、共享内存以及互连形成了一个紧密集成的多处理核心(参见图4)。
On a single integrated circuit, multiple chips, Shared memory, and an interconnect form a tightly integrated core for multiprocessing (see Figure 4).
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