脉冲电镀是指用脉冲电源代替直流电源的电镀。可通过控制波形、频率、通断比及平均电流密度等参数，使电沉积过程在很宽的范围内变化，从而在某种镀液中获得具有一定特性的镀层。
Pulse plating and one additive were both utilized to improve the performances of Ni-W alloy coatings.
采用脉冲电镀工艺和添加剂的方法改进Ni-W合金电镀的基本工艺。
参考来源 - 脉冲电镀NiThe pulse-plated nickel has fine grain, and has the ability to cover uranium substrate fully. The pulse-plating can effectively lower the porosity and decrease the thickness of nickel deposit on uranium.
铀上脉冲电镀镍层结晶细致、对铀基体覆盖完整，脉冲电镀能够有效地改善铀上镍镀层的致密性并降低其厚度。
参考来源 - 铀上脉冲电镀镍的组织结构与性能研究Therefore, how to improve the pulse plating copper process will be the research directions in the future.
因此,如何改善脉冲电镀铜工艺将是目前乃是未来一段时间的研究方向。
参考来源 - 对用于互连线的铜脉冲电镀沉积层的研究The pulse electroplating parameters were optimized to obtain grain-refined and homogeneous Au film.
通过优化脉冲电镀工艺参数,得到了晶粒细密、平整性良好的镀Au层。
参考来源 - 脉冲电镀法制备AuThe effect of direct current plating and periodic pulse reverse plating has been researched. Periodic pulse reverse plating can improve the thickness uniformity and folding endurance of plated copper layer.
电镀铜方面：研究了直流电镀和脉冲电镀的效果，确定脉冲电镀能提有效高镀层均匀性和镀层的弯折强度。
参考来源 - 手机用COF制造工艺关键技术研究·2,447,543篇论文数据，部分数据来源于NoteExpress
脉冲电镀的理论与应用。
采用传统的瓦特镀液通过脉冲电镀制得纯镍镀层。
Pure nickel deposits were obtained from the traditional Watt nickel plating bath by pulse electroplating.
介绍了大容量、智能化高速换向脉冲电镀电源装置的设计方案。
In this paper, the designing of intelligent high speed reverse current pulse plating power supply with high capacity is studied.
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