所有的计算结果证明化合物厚度比为1.2，会使大芯片TSOP的翘曲问题最小化。
All calculations confirm that a compound thickness ratio of 1.2 results in minimal warpage for a large chip TSOP.
本文采用投影散斑相关法对芯片翘曲度进行了测量。
The speckle projection correlation technique is used to measure the chip warpage.
分析了牛顿环法的测量原理，利用牛顿环法对芯片翘曲度进行了测量。
The theory of the Newton ring method is analyzed and the chip warpage is measured by use of the Newton ring method.
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