丝网印刷在双面印年刷电路板（ PCB）工艺中起着重要作用，最关键的环节是要掌握好网印到PCB焊盘上锡焊膏的量，要做到这一点，需要综合控制好多种工艺因素。
The key factor is the proper amount of tin solder to be screen printed onto welded surface of PCB. To do this well, it's necessary to control several technological factors.
本产品主要用于丝印网版的控制，特别适合制作套色印 刷网版，高精度的单双面电路版。
This product is mainly used for control of half-tone screen printing, especcially suitable for making adjustment, high-precision screen double sided circuit.
通过正交实验，得出在不同的刷镀工艺参数组合下镀层的耐磨性和耐腐蚀性，经过分析得出铜网表面最优刷镀工艺参数。
Based on orthogonal experiment, the wear ability and corrode-resisting of brush-plating coat under different brush-plating technology parameter combination are obtained.
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