应力迁移是影响集成电路(IC)金属配线可靠性的缺陷之一。
The stress migration is one of defect that determines metal routing reliability in the IC manufacture.
讨论了常见的组装缺陷和电迁移现象产生的原因及其预防措施。
Discuss some assembly defects and migration for causes and precaution.
文章分析了相关研究的缺陷，提出了一种符合人自然思维习惯的新型实体迁移协议。
After analyzing the flaws of previous studies, this dissertation presents a novel protocol for moving entities, which fits common understandings well.
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