焊罩层配置在介电层上且覆盖线路层。
The solder mask is configured on the dielectric layer and covers the circuit layer.
线路层接触介电层，且线路层具有至少一接垫。
The circuit layer is contacted with the dielectric layer and is provided at least one gasket joint.
线路层、门层等低层能量优化方法已经得到广泛研究。
The energy optimization methods in circuit level and gate level have been investigated widely.
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