该方法适用范围广,测定结果准确,精密度高,相对误差小,在取样量范围里,测定结果不受取样量多寡的影响。
This method possessed wide applicability, accurate and exact result and less relative error. Besides, the determined result can not be affected in the weighable range of sampling.
结果表明,该方法简便、快速、干扰小,测定的准确度和精密度高,适用于电镀过程中铅浓度的跟踪测定。
Results showed that the method, characterized as simple, rapid, little interfere and high accuracy and precise, was suit to monitor the Pb concentration in plating process.
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