介绍各向异性导电胶导电机理和粘接工艺，以及影响它的粘接可靠性因素和最佳参数的研究，如粘接温度、固化时间、粘接压力、粒子含量等。
Many factors impacting on its bonding reliability and the optimum parameters of bonding were studied, such as bonding temperature, curing time, bonding pressure, conductive particles fraction.
怎样依据低熔点玻璃膏的特性，控制一条保证产品质量的温度曲线是保证粘接质量、少出废品的关键。
How to control the temperature curve to fit with the properties of low melting point glass dust is very important to keep the product′s quality.
改性后的玉米氧化淀粉胶粘剂粘接强度好、糊化温度低、粘度适当、抗水性好。
The modified starch adhesive has consistent quality of good viscosity, low gel temperature, good wet tack and water resistance.
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