在电子工业中应用最广泛的导电胶粘剂是以银粉为导电填料以环氧树脂为粘合剂的体系。
The relation between the resistivity of conductive adhesive and the volume fraction of silver fillers was studied.
将该接枝共聚物作为胶粘剂用于纸浆的粘合，与纯变性淀粉粘合剂比较，所压制纸板的性能得到较大的改善。
Great improvement in paper board properties was obtained with pulp using these grafted copolymers as binder in comparison with pure denatured starch binder.
特种硅橡胶粘合剂用于粘合航天飞机上的隔热片。
A special silicone adhesive is used to bond the heat shield tiles on the space shuttle.
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