abbr. PM
misc. plasma machining
晶片等离子体加工室的结构设置成使反应性自由基与放置在晶片等离子体加工室内的晶片表面上的物质反应。
The wafer plasma processing chamber is configured to react the reactive radical with a species at a surface of a wafer disposed in the wafer plasma processing chamber.
等离子体加工技术是在半导体制造中创立起来的一种新技术。
Plasma processing technology is a new technology developed in semiconductor manufacturing.
试验表明，后处理加工中，低温等离子体对FX-2纳米粉体的表面处理能有效消除粉体的自发团聚；
Experiments show that the surface treatment of FX-2 nano powder by use of low temperature plasma can effectively remove the spontaneous agglomeration.
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