将具有与所述多个第一柱对应得多个第二柱的多个裸片放置在所述母器件晶片上。
Plural dies having plural second posts corresponding to the first posts are placed onto the mother device wafer.
接着，使所述焊料回流以接合所述多个第一柱和所 述多个第二柱，并且切割所述母器件晶片。
Then, the solder is reflowed to bond the first and second posts, and the mother device wafer is diced.
第二次喷发融化了大量的冰川冰，使岩浆冷却碎裂成砂质玻璃微粒，被上升的火山灰柱带走。
The second eruption, however, melted a large amount of glacial ice which then cooled and fragmented lava into gritty glass particles that were carried up with the rising volcanic plume.
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