接着，使所述焊料回流以接合所述多个第一柱和所 述多个第二柱，并且切割所述母器件晶片。
Then, the solder is reflowed to bond the first and second posts, and the mother device wafer is diced.
从而，通过将包括预成型的焊料的晶片放置在所述多个第一柱上，而使得所述焊料可以形成在或者粘附在所述多个第一柱上。
Consequently, the solder can be formed on or adhered to the first posts by placing the wafer having pre-formed solder onto the first posts.
因此，虽然LCROSS带给我们的第一个惊喜——微弱的气柱——令人失望，但也许下一个就会让人满意了。
So, while the first LCROSS surprise - the wimpy plume - was disappointing, perhaps the next one the mission delivers will be happy.
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