该方法进一步包括在该种晶层上电镀铜空隙填充。
The method further includes electroplating copper gapfill onto the seed layer.
研究两种晶种对骨水泥固化时间、抗压强度和产物微观结构的影响。
The effects of seeding on the setting time, the compressive strength and the microstructure of the CPC were studied.
扫描电子显微镜图像显示这两种晶界原子结构中的位错排列十分相似。
Imaging with scanning transmission electron microscopy showed that the atomic grain-boundary structure had dislocations that had very similar arrangement.
应用推荐