在此基础上，建立了以单晶硅为工件材料的分子动力学仿真三维模型，对不同深度下的加工过程进行分析研究。

Then, based on these theories, the three-dimensional model with using monocrystal silicon as the workpiece is built and the processes of different grinding deepness is studied.

youdao

提出了V型电热硅微致动器的弯曲振动力学模型。

A flexural oscillation model about V-shaped silicon electro-thermal micro actuator is presented.

youdao

推导了硅微机械振动轮陀螺仪的动力学方程，给出了它的运动规律，分析了载体绕空间任意轴匀速旋转时干扰力矩所引起的漂移率。

This paper gives the dynamic equations of vibratory wheel silicon micromechanical gyroscope and their motion law, analyses drifts of the gyroscope, when vehicle rotates around any axis uniformly.

youdao