研磨片是指利用超精密涂布技术，将精选的微米或纳米级研磨微粉（金刚石、碳化硅、氧化铝、氧化硅、氧化铈等）与高性能粘合剂均匀分散后，涂覆于高强度PET聚酯薄膜(POLYESTER)表面，然后经过高精度裁剪工艺加工而成。
对压敏电阻的磨片工艺进行了探讨，并提出了一种新的磨片工艺：双端面研磨，采用贯穿送料和连续磨削的方法。
An approach is made on grinding process for varistor and a new dual surface grinding process with through feeding and continuous grinding is proposed.
磨盘实际间隙是指动磨片和定磨片在研磨区内齿表面之间的距离。
Real plate gap means the clearance between the surface of stationary disc and the surface of rotating disc in refining zone.
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