... 外通孔 accessible porosity 乌通孔 utonkon 直通孔 durchgangsbohrung through-hole ...
基于4个网页-相关网页
硅片直通孔封装技术 through-silicon via packaging
封头螺柱直通孔 through hole for closure stud
主轴通孔直径 Spindle bore ; Thru-hole of spindle ; Spindle hole ; through hole dlameter
硅直通孔 TSV ; Through-Silicon Via
主轴中心通孔直径 Hole through spindle
通孔直径 through-hole diameter ; Spindle bore ; Hole diameter ; Opening Dia
直通硅晶穿孔技术 through-silicon-vias ; TSV
立轴通孔直径 Spindle inner diameter
主孔径/主轴通孔直径 Diameter of spindle through bore/bar ; Diameter of spindle bore/Draw bar bore
对于垂直通孔互连问题，时域有限差分法更具优势。
FDTD method is better than the other one for vertical via interconnect problem.
在垂直通孔的上端，设置有控制上火量的旋转控制阀。
The upper end of the vertical through hole is provided with a rotary control valve which controls the fire-feeding amount.
垂直通孔互连是微波多芯片组件封装工艺和理论分析的基础，开展垂直通孔互连的研究有着现实的意义。
Because vertical via interconnect is the base of theoretical analysis and package technics of MMCM, further study on vertical via interconnect is very vital and instructive to reality.
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