试件的通流尺寸、电阻率、导入电流密度是影响裂纹尖端温度场和温度梯度场的主要因素。
The size of current path, resistivity, power density are main factors that effect the temperature field and temperature gradient field at crack tip.
本文讨论了大梯度应变区电阻应变片的设计问题。
The design of strain gages in regions of high strain gradient is discussed.
从传统电位梯度和高梯度电阻片显微结构分析中得出，晶粒细小化是提高电位梯度的重要途径。
As seen from convenient microstructure of varistor with high gradient and discharge capacity the essential way to enhance electric gradient is crystal miniaturization.
应用推荐