该分析主要考虑像电网风电，负载和历史清算价格的因素。
The analysis main consider the factors like grid-connected wind power, load and historical clearing price.
在单片机用户系统的设计中，必须对硬件和软件进行具体仿真。通过分析单片机系统的晶振电路、上电总清和负载能力来解决实际遇到的问题。
This paper introduces simulation methods of MCU hardware and software systems and help to solve actual problems by analyzing crystal circuit, electriferous reset and load capacity of the systems.
分析了粗糙度对电触头，尤其是轻负载用电触头接触电阻的影响。
Coarseness effects on contact resistance of electric contacts, especially, light_duty ones were analyzed.
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